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Diamond Segment
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Grinding&Polishing Tools
Wire Saw Machine
Exhibition
Domestic exhibitions
International exhibitions
Factory
Quarry Resource
Factory
Workshop
Activity Center
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Honor Certificate
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Case
Granite Mining Application
Marble Mining Application
Reinforced Concrete Cutting Application
Contact Us
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Gemstone Grinding Head
Diamond Segment
Diamond Wire Saw
Diamond Saw Blade
Grinding&Polishing Tools
Wire Saw Machine
ZL-BSMT-001
Source：ZhongLi Tools Time：2023-10-31 01:50:11 Views：114
Product Features
Used for thinning sapphire substrates
Main Technical Parameters
Product Name
Model
Application
Gemstone Grinding Head
35mmx4.4mmx17mm
Used for thinning sapphire substrates
Tips：Other specifications can be customized according to customer needs.
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